Sony has quietly introduced a hardware modification to newer PlayStation 5 models to address a long-standing issue with liquid metal coolant leaks. The change, which affects PS5 Slim and certain standard PS5 units, aims to prevent the thermal interface material from migrating or spilling, a problem that had made some owners wary of storing the console vertically.
The updated design, already present in the PlayStation 5 Pro, uses engraved grooves or trenches to better secure the liquid metal between the APU and heatsink, rather than a simple dollop. This reduces the likelihood of leaks and improves long-term stability, according to reports.
Newer PS5 Slim hardware revisions, identifiable by module codes CFI-2100 and CFI-2200, now feature this improved thermal interface material layout. The issue was particularly prevalent when consoles were positioned vertically or moved frequently, leading to uneven cooling, dry patches on the APU, increased fan noise, and in severe cases, hardware stress.
Reaction on Reddit has been mixed, with some users expressing relief. One Redditor commented: 'I always keep my PS5 Pro horizontal because of this issue. Great to hear they fixed it. So I can finally place it upright.' Another added: 'Didn't even know this was a problem but seems like a pretty massive one since Liquid Metal can cause shorts on the boards.'
